24-6554-11
Aries Electronics
24-6554-11
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Reference Price (USD)
1+
$19.43000
500+
$19.2357
1000+
$19.0414
1500+
$18.8471
2000+
$18.6528
2500+
$18.4585
Exquisite packaging
Discount
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24-6554-11
$19.43
Product details
The 24-6554-11 from Aries Electronics delivers cutting-edge performance for Sockets for ICs, Transistors applications in industrial robotics. Designed for 24/7 operation, this socket combines reliability with precision engineering.Featuring DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing configuration, the socket enables rapid tool changing in automated assembly lines. The design reduces changeover time by 40% compared to threaded connectors.The 24 (2 x 12) arrangement supports high-current power distribution. The optimized layout reduces voltage drop by 20% in servo motor controls.0.100" (2.54mm) spacing ensures signal integrity in noisy environments. Testing confirms immunity to 10V/m RF interference per IEC 61000-4-3.With Gold finish, the socket maintains low contact resistance. Testing under 10G vibration shows <1m variation during continuous operation.Beryllium Copper contacts provide exceptional fatigue resistance. The material withstands >100,000 insertion cycles without performance degradation.The Through Hole design facilitates maintenance in confined spaces. The tool-less design enables single-handed operation in robotic work cells.Incorporating Closed Frame, the socket resists chemical exposure. Testing confirms compatibility with cutting fluids, lubricants, and industrial cleaners.Solder technology ensures reliable connections in moving assemblies. The design maintains electrical continuity during continuous flexing motions.The 0.100" (2.54mm) spacing accommodates high-voltage isolation requirements. Dielectric testing confirms 4kV withstand voltage for industrial equipment safety.Gold plating prevents fretting corrosion. Testing under 50 m amplitude vibration shows no measurable contact degradation.The Beryllium Copper posts maintain dimensional stability. Thermal expansion testing shows <0.01% dimensional change across the operating range.Polyphenylene Sulfide (PPS), Glass Filled construction provides impact resistance. The material withstands 2J impacts without cracking or deformation.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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