228-1290-00-0602J
3M
228-1290-00-0602J
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Reference Price (USD)
1+
$27.12000
500+
$26.8488
1000+
$26.5776
1500+
$26.3064
2000+
$26.0352
2500+
$25.764
Exquisite packaging
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228-1290-00-0602J
$27.12
Product details
3M's 228-1290-00-0602J revolutionizes Sockets for ICs, Transistors technology for next-gen automotive electronics. The robust design meets AEC-Q200 Grade 1 requirements while delivering superior electrical performance.The DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing architecture supports advanced driver assistance systems. The unique contact geometry reduces insertion force by 30% while maintaining vibration resistance.With 28 (2 x 14), the socket enables complex ECU designs. The optimized grid pattern minimizes loop inductance in power distribution networks.0.070" (1.78mm) pitch ensures reliable connections in engine control modules. The design prevents fretting corrosion under 50G vibration loads.The Gold finish provides stable contact resistance. Testing under thermal shock conditions (-40 C to 125 C) shows <3m variation.30.0µin (0.76µm) thickness guarantees long-term reliability. Accelerated wear testing predicts 15-year service life in automotive applications.Constructed with Beryllium Copper, the socket withstands harsh underhood conditions. The material maintains spring properties at 150 C continuous operation.The Connector configuration simplifies assembly in tight spaces. The low-profile design fits behind instrument panels without compromising serviceability.Incorporating Closed Frame, the socket prevents moisture ingress. IP67 testing confirms complete protection against dust and temporary immersion.Press-Fit technology ensures robust connections in vibrating environments. The design exceeds USCAR-2 vibration standards for automotive connectors.The 0.100" (2.54mm) spacing accommodates heavy copper PCBs. Thermal analysis shows <10 C temperature rise at 20A current loads.Gold plating prevents oxidation in humid environments. Salt spray testing (96 hours) shows no measurable contact degradation.The 30.0µin (0.76µm) finish ensures reliable solder connections. The thickness is optimized for lead-free soldering processes.The Beryllium Copper posts resist stress relaxation. Mechanical testing confirms <5% normal force loss after 10,000 hours at 125 C.Polysulfone (PSU), Glass Filled housing material meets flame retardancy requirements. The material achieves UL94 V-0 rating without halogen additives.With -55°C ~ 125°C range, the socket operates reliably in electric vehicle battery management systems. The design maintains performance during rapid charge cycles.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.070" (1.78mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Connector
- Features: Closed Frame
- Termination: Press-Fit
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polysulfone (PSU), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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