1SX165HU3F50E2VG
Intel
1SX165HU3F50E2VG
Intel
IC FPGA STRATIX 10 2397FBGA
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Product details
Engineered for next-generation automotive electronics, Intel's 1SX165HU3F50E2VG redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making 1SX165HU3F50E2VG the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 1.5GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.FPGA - 1650K Logic Elements include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 2397-BBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 2397-FBGA, FC (50x50), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 1650K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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