1SX250HU3F50I3XG
Intel
1SX250HU3F50I3XG
Intel
IC FPGA STRATIX 10 2397FBGA
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Product details
The 1SX250HU3F50I3XG from Intel delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making 1SX250HU3F50I3XG particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 1.5GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.FPGA - 2500K Logic Elements include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for -40°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 2397-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 2397-FBGA, FC (50x50), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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