1SX085HN1F43I1VG
Intel
1SX085HN1F43I1VG
Intel
IC FPGA STRATIX 10 1760FBGA
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Product details
Engineered for next-generation consumer electronics, Intel's 1SX085HN1F43I1VG revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making 1SX085HN1F43I1VG ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MCU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.With 256KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DMA, WDT include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 1.5GHz, the processor meets the real-time requirements of always-listening voice interfaces.FPGA - 850K Logic Elements include hardware-accelerated neural network processing for on-device AI capabilities.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 1760-BBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 1760-FBGA (42.5x42.5), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 850K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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