1SX110HN2F43I1VG
Intel
1SX110HN2F43I1VG
Intel
IC FPGA STRATIX 10 1760FBGA
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Product details
Intel's 1SX110HN2F43I1VG redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making 1SX110HN2F43I1VG the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 1.5GHz, the processor meets the real-time requirements of high-channel-count audio systems.FPGA - 1100K Logic Elements include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 1760-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 1760-FBGA (42.5x42.5), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 1100K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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