1SG250HH2F55E2VG

The 1SG250HH2F55E2VG from Intel represents a cutting-edge solution in Embedded - FPGAs (Field Programmable Gate Array), engineered for high-performance signal processing applications. This FPGA delivers exceptional logic density and power efficiency, making it ideal for 5G infrastructure and advanced radar systems. With its robust architecture and flexible I/O configuration, designers can achieve unprecedented levels of system integration while maintaining signal integrity across demanding operating conditions.The 312500 logic array blocks provide a hierarchical structure for modular design implementation. Each CLB features dedicated carry chains for arithmetic acceleration and specialized routing for clock domain crossing management.Featuring 2500000 programmable logic elements, this device enables complex digital circuit implementation with optimal resource utilization. When compared to similar FPGAs in its class, the cell density allows for more parallel processing paths while maintaining clock synchronization accuracy.With 1160 configurable I/O ports, the device offers exceptional interface flexibility for mixed-signal environments. The I/O banks are optimized for simultaneous switching noise reduction, crucial for maintaining signal fidelity in high-speed communication protocols.Operating within 0.77V ~ 0.97V voltage range, this FPGA achieves superior power efficiency without compromising computational throughput. The adaptive voltage scaling feature dynamically adjusts power consumption based on workload demands.Designed for Surface Mount installation, the package ensures reliable mechanical and electrical connections in space-constrained applications. The mounting solution has been validated for vibration resistance in automotive electronics environments.Rated for 0°C ~ 100°C (TJ) operation, this component maintains stable clock distribution networks even under extreme thermal conditions. The temperature-compensated circuitry prevents timing skew in precision measurement systems.The 2912-BBGA, FCBGA package format provides optimal thermal dissipation for high-density logic implementations. Compared to conventional packaging, this solution reduces parasitic inductance for improved signal propagation characteristics.Available in 2912-FBGA, FC (55x55) configuration, the device supports standardized PCB layout practices while offering enhanced EMI shielding. The package geometry has been optimized for wave soldering compatibility in high-volume production.