1SG250HH3F55E2LG

The 1SG250HH3F55E2LG by Intel establishes new benchmarks in Embedded - FPGAs (Field Programmable Gate Array), specifically designed for AI acceleration and neural network processing. This FPGA features an innovative architecture that combines high-speed data throughput with energy-efficient computation, making it perfect for edge computing devices and smart city infrastructure. Its adaptive clock distribution network ensures precise timing alignment across multiple processing cores.Organized into 312500 logic blocks, the architecture supports modular design methodologies. Each block features dedicated carry chains for arithmetic-intensive operations.Boasting 2500000 programmable logic elements, this device enables massive parallel processing required for deep learning algorithms. When operating in neural network mode, the logic fabric demonstrates superior performance per watt compared to traditional processing architectures.Featuring 1160 configurable I/O channels, the device offers unparalleled flexibility for sensor fusion applications. Each I/O bank includes adaptive impedance matching to maintain signal quality across varying load conditions.Operating within 0.82V ~ 0.88V range, this FPGA implements dynamic voltage and frequency scaling to optimize power consumption. The power delivery network features low-ESR decoupling capacitors for clean power distribution.Designed for Surface Mount installation, the package ensures reliable operation in thermally challenging environments. The advanced thermal interface material minimizes junction-to-case thermal resistance.Rated for 0°C ~ 100°C (TJ) operation, the device maintains stable performance in outdoor deployment scenarios. The temperature-compensated bias circuits prevent parameter drift in precision measurement applications.The 2912-BBGA, FCBGA package incorporates advanced EMI shielding techniques for RF-sensitive applications. The package geometry has been optimized for efficient heat dissipation in confined spaces.Available in 2912-FBGA, FC (55x55) configuration, the device supports high-volume automated assembly processes. The packaging includes moisture sensitivity indicators for quality control.