173708-0002
Molex
Product details
The 173708-0002 by Molex revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Featuring Receptacle configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.With 1 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.1 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.Through Hole, Right Angle installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: -
- Connector Type: Receptacle
- Connector Style: -
- Number of Positions: 1
- Number of Positions Loaded: All
- Pitch: -
- Number of Rows: 1
- Number of Columns: -
- Mounting Type: Through Hole, Right Angle
- Termination: Press-Fit
- Contact Layout, Typical: -
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black