2057764-3

The 2057764-3 from TE Connectivity AMP Connectors represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Backplane applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Header, Male Pins configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring Impact technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 72 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.075" (1.90mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 9 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 8 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Board Edge, Through Hole, Right Angle mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Press-Fit methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.The 48 Signal, 24 Ground arrangement optimizes impedance matching while providing balanced power delivery - crucial for maintaining signal integrity in 5G base station applications.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Black housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.