172-PLS16002-12
Aries Electronics
172-PLS16002-12
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Reference Price (USD)
1+
$104.82000
500+
$103.7718
1000+
$102.7236
1500+
$101.6754
2000+
$100.6272
2500+
$99.579
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
172-PLS16002-12
$104.82
Product details
Aries Electronics's 172-PLS16002-12 revolutionizes Sockets for ICs, Transistors technology for next-gen automotive electronics. The robust design meets AEC-Q200 Grade 1 requirements while delivering superior electrical performance.The PGA, ZIF (ZIP) architecture supports advanced driver assistance systems. The unique contact geometry reduces insertion force by 30% while maintaining vibration resistance.0.100" (2.54mm) pitch ensures reliable connections in engine control modules. The design prevents fretting corrosion under 50G vibration loads.The Gold finish provides stable contact resistance. Testing under thermal shock conditions (-40 C to 125 C) shows <3m variation.30.0µin (0.76µm) thickness guarantees long-term reliability. Accelerated wear testing predicts 15-year service life in automotive applications.Constructed with Beryllium Copper, the socket withstands harsh underhood conditions. The material maintains spring properties at 150 C continuous operation.The Through Hole configuration simplifies assembly in tight spaces. The low-profile design fits behind instrument panels without compromising serviceability.Incorporating Closed Frame, the socket prevents moisture ingress. IP67 testing confirms complete protection against dust and temporary immersion.Solder technology ensures robust connections in vibrating environments. The design exceeds USCAR-2 vibration standards for automotive connectors.The 0.100" (2.54mm) spacing accommodates heavy copper PCBs. Thermal analysis shows <10 C temperature rise at 20A current loads.Tin plating prevents oxidation in humid environments. Salt spray testing (96 hours) shows no measurable contact degradation.The 200.0µin (5.08µm) finish ensures reliable solder connections. The thickness is optimized for lead-free soldering processes.The Beryllium Copper posts resist stress relaxation. Mechanical testing confirms <5% normal force loss after 10,000 hours at 125 C.Polyphenylene Sulfide (PPS) housing material meets flame retardancy requirements. The material achieves UL94 V-0 rating without halogen additives.With -65°C ~ 125°C range, the socket operates reliably in electric vehicle battery management systems. The design maintains performance during rapid charge cycles.
Product Attributes
- Product Status: Active
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -65°C ~ 125°C
You May Also Be Interested In