558-10-357M19-001104
Preci-Dip
558-10-357M19-001104
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Reference Price (USD)
1+
$46.21735
500+
$45.7551765
1000+
$45.293003
1500+
$44.8308295
2000+
$44.368656
2500+
$43.9064825
Exquisite packaging
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558-10-357M19-001104
$46.22
Product details
Designed for mission-critical systems, 558-10-357M19-001104 by Preci-Dip sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The BGA configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 357 (19 x 19) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.050" (1.27mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 10.0µin (0.25µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Brass contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Surface Mount design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Closed Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.050" (1.27mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Gold plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 10.0µin (0.25µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Brass posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).FR4 Epoxy Glass housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.Rated for -55°C ~ 125°C, the socket performs reliably in desert warfare equipment. Testing confirms full functionality during rapid temperature transitions.
Product Attributes
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 357 (19 x 19)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Brass
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C
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