10AS027E4F29E3SG
Intel
10AS027E4F29E3SG
Intel
IC SOC CORTEX-A9 1.5GHZ 780FBGA
Reference Price (USD)
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$1025.65000
500+
$1015.3935
1000+
$1005.137
1500+
$994.8805
2000+
$984.624
2500+
$974.3675
Exquisite packaging
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10AS027E4F29E3SG
$1,025.65
Product details
Intel's 10AS027E4F29E3SG redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making 10AS027E4F29E3SG the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, POR, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 1.5GHz, the processor meets the real-time requirements of high-channel-count audio systems.FPGA - 270K Logic Elements include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for 0°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 780-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 780-FBGA, FC (29x29), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA, FC (29x29)
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