XCZU9CG-2FFVC900E
AMD Xilinx
XCZU9CG-2FFVC900E
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
1+
$3719.52000
500+
$3682.3248
1000+
$3645.1296
1500+
$3607.9344
2000+
$3570.7392
2500+
$3533.544
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCZU9CG-2FFVC900E
$3,719.52
Product details
The XCZU9CG-2FFVC900E by AMD Xilinx is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 533MHz, 1.3GHz, the processor balances performance with power efficiency for always-on sensing applications.Zynq®UltraScale+™ FPGA, 599K+ Logic Cells feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for 0°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 900-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 900-FCBGA (31x31), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
You May Also Be Interested In
