ZGP323LAP2016C
Zilog
ZGP323LAP2016C
Zilog
IC MCU 8BIT 16KB OTP 20DIP
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ZGP323LAP2016C
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Product details
Designed for industrial IoT applications, the ZGP323LAP2016C by Zilog redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The Z8 core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 8-Bit architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 8MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.HLVD, POR, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 16 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.16KB (16K x 8) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The OTP implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.237 x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 2V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 125°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Through Hole packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 20-DIP (0.300", 7.62mm) format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.
Product Attributes
- Product Status: Obsolete
- Core Processor: Z8
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: HLVD, POR, WDT
- Number of I/O: 16
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 237 x 8
- Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Through Hole
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: -
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