YTW-50-06-L-Q-400-110
Samtec Inc.
YTW-50-06-L-Q-400-110
Samtec Inc.
CONN HD ARRAY PLG 200P VERT GOLD
Reference Price (USD)
1+
$35.53000
500+
$35.1747
1000+
$34.8194
1500+
$34.4641
2000+
$34.1088
2500+
$33.7535
Exquisite packaging
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YTW-50-06-L-Q-400-110
$35.53
Product details
The YTW-50-06-L-Q-400-110 by Samtec Inc. redefines Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) for IoT edge computing devices. This ultra-compact connector solution combines high-speed data transmission with power-over-Ethernet capabilities, making it perfect for smart city infrastructure and industrial IoT gateways.Featuring a High Density Array, Male design, this connector achieves 40Gbps data rates while maintaining PoE++ compatibility. The hybrid architecture supports simultaneous power delivery and high-speed differential signaling.With 200 contact arrangements available, designers can implement mixed-signal configurations. The optimized layout minimizes ground loop interference in sensor fusion applications.The micro 0.079" (2.00mm) spacing enables compact designs for space-constrained IoT nodes. This precision spacing has been validated for 10-year reliability in outdoor temperature cycling conditions.The 4 row configuration provides isolated power and signal paths. This arrangement prevents noise coupling between sensitive analog sensors and digital processors.Optimized for Through Hole installation, the connector features self-aligning guides for blind mating. The design withstands 500+ insertion cycles in field-serviceable equipment.The Gold technology prevents oxidation in high-humidity environments. Testing shows contact resistance stability within 2m after 1,000 humidity cycles.With 10.0µin (0.25µm) protection, the contacts maintain reliable connections despite micro-motion. This specification is critical for vibration-prone industrial environments.The low 0.400" (10.16mm) profile minimizes wind loading in outdoor installations. This design consideration is crucial for antenna-mounted IoT devices.
Product Attributes
- Product Status: Active
- Connector Type: High Density Array, Male
- Number of Positions: 200
- Pitch: 0.079" (2.00mm)
- Number of Rows: 4
- Mounting Type: Through Hole
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Mated Stacking Heights: -
- Height Above Board: 0.400" (10.16mm)
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