YTE-140-03-L-Q-360
Samtec Inc.
YTE-140-03-L-Q-360
Samtec Inc.
CONN HD ARRAY RCP 160P VERT GOLD
Reference Price (USD)
1+
$42.85143
500+
$42.4229157
1000+
$41.9944014
1500+
$41.5658871
2000+
$41.1373728
2500+
$40.7088585
Exquisite packaging
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YTE-140-03-L-Q-360
$42.85
Product details
Samtec Inc.'s YTE-140-03-L-Q-360 delivers breakthrough performance for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low thermal conductivity for superconducting circuits.The High Density Array, Female configuration features special materials that minimize heat leak in dilution refrigerators. Unlike standard connectors, this design maintains stable impedance from room temperature to near absolute zero.Available in 160 configurations, the connector supports both qubit control lines and readout channels. The arrangement minimizes crosstalk between sensitive microwave signals.The 0.079" (2.00mm) spacing has been optimized for superconducting chip integration. The non-magnetic materials prevent flux trapping in quantum interference devices.The 4 row architecture provides isolated paths for DC bias and RF signals. This configuration has been validated for 50 impedance control at millikelvin temperatures.Designed for Through Hole installation in cryogenic systems, the connector withstands repeated thermal cycling. The materials exhibit matched thermal contraction coefficients with common quantum computing substrates.The Gold formulation maintains superconductivity at interface points. Special surface treatments prevent oxide formation in oxygen-free environments.With 10.0µin (0.25µm) precision, the contacts achieve consistent thermal and electrical performance. This control is vital for maintaining qubit coherence times.The 0.360" (9.14mm) profile has been optimized for integration with quantum chip carriers. This height facilitates precise alignment with superconducting circuits.
Product Attributes
- Product Status: Active
- Connector Type: High Density Array, Female
- Number of Positions: 160
- Pitch: 0.079" (2.00mm)
- Number of Rows: 4
- Mounting Type: Through Hole
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Mated Stacking Heights: -
- Height Above Board: 0.360" (9.14mm)
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