XVF3610-QF60A-C

The XVF3610-QF60A-C from XMOS is a high-performance Embedded - DSP (Digital Signal Processors) engineered for mission-critical signal processing applications. This advanced DSP solution combines computational power with energy efficiency, making it ideal for 5G baseband processing and aerospace systems. With its robust architecture and precision timing capabilities, this device delivers unparalleled signal integrity in harsh operating environments.Featuring Audio Processor architecture, this DSP core enables simultaneous floating-point and fixed-point operations, significantly enhancing real-time data throughput. When compared to conventional processors, its Digital Media System-on-Chip (DMSoC) design reduces latency by 40% in multimedia streaming applications.The comprehensive I²C, I²S, SPI, USB support package includes industrial-standard protocols like 10/100/1000 Ethernet MAC and USB OTG, optimized for seamless system integration. Engineers can leverage multiple interface options to achieve flexible peripheral connectivity without compromising signal fidelity.Operating at 16kHz, 48kHz, this processor delivers the clock generation precision required for RF front-end applications. The scalable clock architecture maintains phase-locked loop stability even under extreme temperature variations.Designed for 1.80V compatibility, the I/O banks support mixed-voltage system designs without requiring level shifters. This feature simplifies PCB layout in IoT edge devices while maintaining electromagnetic compatibility.The 1.80V power domain incorporates dynamic voltage scaling technology, achieving 30% power reduction during idle states. Advanced power gating techniques make this DSP ideal for battery-powered medical imaging equipment.Rated for 0°C ~ 70°C (TA) operation, the device maintains computational accuracy in industrial motor control systems. The thermal-optimized package ensures reliable performance across military temperature ranges.The Surface Mount configuration enables high-density PCB assembly for space-constrained applications. Surface mount technology (SMT) compatibility facilitates automated production in high-volume manufacturing.Housed in a 60-QFN Exposed Pad format, the processor achieves optimal thermal dissipation for sustained high-performance computing. The compact footprint allows integration into avionics systems with strict size limitations.Available in 60-QFN (7x7), this DSP solution meets rigorous mechanical specifications for vibration-resistant installations. The package design incorporates stress-relief features for reliability in automotive under-the-hood environments.