XVF3500-FB167-C
XMOS
XVF3500-FB167-C
XMOS
IC MCU 32BIT 2MB FLASH 167FBGA
Reference Price (USD)
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$23.25000
500+
$23.0175
1000+
$22.785
1500+
$22.5525
2000+
$22.32
2500+
$22.0875
Exquisite packaging
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XVF3500-FB167-C
$23.25
Product details
XMOS's XVF3500-FB167-C sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The XCore core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 500MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With Ethernet, SPI, USB protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive PWM suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.59 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.2MB (2M x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.2K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 0.95V ~ 1.05V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for 0°C ~ 70°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.167-LFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 167-FBGA (12x7.5), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit Single-Core
- Speed: 500MHz
- Connectivity: Ethernet, SPI, USB
- Peripherals: PWM
- Number of I/O: 59
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 1.05V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 167-LFBGA
- Supplier Device Package: 167-FBGA (12x7.5)
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