XS1-U12A-128-FB217-C10

XMOS

General info

Part Number

Manufacturer

XMOS

Description:

IC MCU 32BIT 128KB SRAM 217FBGA

Datasheet:

XS1-U12A-128-FB217-C10 PDF XS1-U12A-128-FB217-C10 Datasheet

Reference Price (USD)

$27.68833

500+

$27.4114467

1000+

$27.1345634

1500+

$26.8576801

2000+

$26.5807968

2500+

$26.3039135

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XS1-U12A-128-FB217-C10

$27.69

Product details

The XS1-U12A-128-FB217-C10 from XMOS represents a cutting-edge solution in Embedded - Microcontrollers, engineered for mission-critical embedded systems. This microcontroller combines robust processing capabilities with exceptional signal integrity, making it ideal for 5G infrastructure and industrial automation applications where timing precision is paramount.Featuring an XCore architecture, this IC delivers deterministic performance for real-time control applications. When paired with its advanced clock generation circuits, it achieves superior processing efficiency compared to conventional designs.With its 32-Bit 12-Core data path architecture, the device enables concurrent processing of multiple sensor inputs while maintaining ultra-low latency - a critical requirement for industrial IoT edge nodes.Operating at 1000MIPS, the microcontroller provides the ideal balance between power consumption and throughput, particularly beneficial for battery-powered field instruments requiring extended operational life.The integrated Configurable interfaces support daisy-chaining of peripheral devices without compromising signal fidelity, essential for automotive CAN bus implementations and distributed sensor networks.With 73 configurable GPIOs, designers can implement complex control matrices while maintaining spare capacity for future expansion, particularly valuable in modular industrial equipment.The 128KB (32K x 32) non-volatile storage accommodates sophisticated control algorithms with room for over-the-air updates, crucial for smart grid applications requiring field upgradability.SRAM technology ensures rapid boot times and exceptional data retention, outperforming traditional storage methods in harsh environmental conditions.The 3V ~ 3.6V operating range makes this device compatible with both legacy and modern power architectures, simplifying migration from older systems.Precision A/D 8x12b provide <1 LSB nonlinearity for accurate sensor signal conditioning, particularly important in medical diagnostic equipment where measurement accuracy is critical.The Internal clock source implementation reduces BOM costs while maintaining jitter performance below 1% of period, meeting stringent RF communication requirements.Rated for 0°C ~ 70°C (TA), this microcontroller maintains timing stability across extreme environmental conditions, making it suitable for downhole drilling instrumentation.Surface Mount packaging enables high-density PCB layouts while withstanding mechanical stress, ideal for vibration-prone automotive underhood applications.The 217-LFBGA format provides optimal thermal dissipation for continuous operation at maximum clock speeds, addressing thermal challenges in sealed industrial enclosures.Available in 217-FBGA (16x16), the device supports both prototype development and volume production with identical performance characteristics.