XS1-L8A-128-QF124-C10

XMOS

General info

Part Number

Manufacturer

XMOS

Description:

IC MCU 32BIT 128KB SRAM 124QFN

Reference Price (USD)

$18.70359

500+

$18.5165541

1000+

$18.3295182

1500+

$18.1424823

2000+

$17.9554464

2500+

$17.7684105

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XS1-L8A-128-QF124-C10

$18.70

Product details

XMOS's XS1-L8A-128-QF124-C10 delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The XCore core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit 8-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 1000MIPS, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The Configurable interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.With 84 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.128KB (32K x 32) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The SRAM implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.The 0.95V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for 0°C ~ 70°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 124-TFQFN Dual Rows, Exposed Pad format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 124-QFN DualRow (10x10), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.