XS1-A12A-128-FB217-I10

XMOS

General info

Part Number

Manufacturer

XMOS

Description:

IC MCU 32BIT 128KB SRAM 217FBGA

Datasheet:

XS1-A12A-128-FB217-I10 PDF XS1-A12A-128-FB217-I10 Datasheet

Reference Price (USD)

$33.66643

500+

$33.3297657

1000+

$32.9931014

1500+

$32.6564371

2000+

$32.3197728

2500+

$31.9831085

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XS1-A12A-128-FB217-I10

$33.67

Product details

Designed for industrial IoT applications, the XS1-A12A-128-FB217-I10 by XMOS redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The XCore core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit 12-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 1000MIPS with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The Configurable interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.With 90 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.128KB (32K x 32) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The SRAM implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.The 0.90V ~ 5.5V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 8x12b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 85°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 217-LFBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 217-FBGA (16x16), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.