XR2E-3205
Omron Electronics Inc-EMC Div
XR2E-3205
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
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Product details
Omron Electronics Inc-EMC Div's XR2E-3205 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The SIP architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 32 (1 x 32) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Gold finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.Gold plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The Beryllium Copper posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Polybutylene Terephthalate (PBT), Glass Filled housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.Rated for -55°C ~ 125°C, the socket performs reliably in cryogenic applications. Testing confirms operation from -196 C to +150 C for liquid nitrogen environments.
Product Attributes
- Product Status: Obsolete
- Type: SIP
- Number of Positions or Pins (Grid): 32 (1 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: -
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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