XR2C-3205
Omron Electronics Inc-EMC Div
XR2C-3205
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Reference Price (USD)
1+
$7.77000
500+
$7.6923
1000+
$7.6146
1500+
$7.5369
2000+
$7.4592
2500+
$7.3815
Exquisite packaging
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XR2C-3205
$7.77
Product details
Omron Electronics Inc-EMC Div's XR2C-3205 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The SIP architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 32 (1 x 32), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.100" (2.54mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 30.0µin (0.76µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Closed Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.100" (2.54mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 30.0µin (0.76µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Beryllium Copper posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polybutylene Terephthalate (PBT), Glass Filled housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.Rated for -55°C ~ 125°C, the socket operates from room temperature to 10mK. Testing confirms <0.1% dimensional change during cooldown.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 32 (1 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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