XR2C-2000-HSG
Omron Electronics Inc-EMC Div
XR2C-2000-HSG
Omron Electronics Inc-EMC Div
CONN IC SOCKET 20POS
Reference Price (USD)
1+
$0.13200
500+
$0.13068
1000+
$0.12936
1500+
$0.12804
2000+
$0.12672
2500+
$0.1254
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XR2C-2000-HSG
$0.13
Product details
Omron Electronics Inc-EMC Div's XR2C-2000-HSG enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The Housing architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 20 (1 x 20), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.100" (2.54mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.Incorporating Closed Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.100" (2.54mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.The Beryllium Copper posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polybutylene Terephthalate (PBT), Glass Filled housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.Rated for -55°C ~ 125°C, the socket operates from room temperature to 10mK. Testing confirms <0.1% dimensional change during cooldown.
Product Attributes
- Product Status: Obsolete
- Type: Housing
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: -
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
You May Also Be Interested In