XPC8260CVVIFBC
Freescale Semiconductor
XPC8260CVVIFBC
Freescale Semiconductor
RISC MICROPROCESSOR, 32 BIT, POW
Reference Price (USD)
1+
$224.75000
500+
$222.5025
1000+
$220.255
1500+
$218.0075
2000+
$215.76
2500+
$213.5125
Exquisite packaging
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XPC8260CVVIFBC
$224.75
Product details
The XPC8260CVVIFBC by Freescale Semiconductor establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC G2 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 200MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Communications; RISC CPM neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DRAM, SDRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100Mbps (3) connectivity enables distributed AI processing across edge nodes with precise time synchronization.Designed with 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.The 480-LBGA Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 480-TBGA (37.5x37.5), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA Exposed Pad
- Supplier Device Package: 480-TBGA (37.5x37.5)
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