XOMAPL138ZCE
Texas Instruments
XOMAPL138ZCE
Texas Instruments
IC MPU OMAP-L1X 300MHZ 361NFBGA
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Product details
The XOMAPL138ZCE by Texas Instruments establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM926EJ-S neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 300MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Signal Processing; C674x, System Control; CP15 neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The SDRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 3Gbps (1) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 1.1 + PHY (1), USB 2.0 + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for 0°C ~ 90°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Boot Security, Cryptography include model encryption and secure model update mechanisms for protected edge AI deployments.The 361-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 361-NFBGA (13x13), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: 10/100Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Security Features: Boot Security, Cryptography
- Package / Case: 361-LFBGA
- Supplier Device Package: 361-NFBGA (13x13)
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