XOMAP3530BCBB
Texas Instruments
XOMAP3530BCBB
Texas Instruments
IC MPU OMAP-35XX 600MHZ 515FCBGA
Reference Price (USD)
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$66.73000
500+
$66.0627
1000+
$65.3954
1500+
$64.7281
2000+
$64.0608
2500+
$63.3935
Exquisite packaging
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XOMAP3530BCBB
$66.73
Product details
The XOMAP3530BCBB by Texas Instruments establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A8 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 600MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Signal Processing; C64x+, Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.The USB 1.x (3), USB 2.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.0V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for 0°C ~ 90°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.The 515-VFBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 515-POP-FCBGA (12x12), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD
- Ethernet: -
- SATA: -
- USB: USB 1.x (3), USB 2.0 (1)
- Voltage - I/O: 1.8V, 3.0V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Security Features: -
- Package / Case: 515-VFBGA, FCBGA
- Supplier Device Package: 515-POP-FCBGA (12x12)
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