XLF210-512-FB236-I20
XMOS
XLF210-512-FB236-I20
XMOS
IC MCU 32BIT 2MB FLASH 236FBGA
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Product details
The XLF210-512-FB236-I20 from XMOS represents a cutting-edge solution in Embedded - Microcontrollers, engineered for mission-critical embedded systems. This microcontroller combines robust processing capabilities with exceptional signal integrity, making it ideal for 5G infrastructure and industrial automation applications where timing precision is paramount.Featuring an XCore architecture, this IC delivers deterministic performance for real-time control applications. When paired with its advanced clock generation circuits, it achieves superior processing efficiency compared to conventional designs.With its 32-Bit 10-Core data path architecture, the device enables concurrent processing of multiple sensor inputs while maintaining ultra-low latency - a critical requirement for industrial IoT edge nodes.Operating at 2000MIPS, the microcontroller provides the ideal balance between power consumption and throughput, particularly beneficial for battery-powered field instruments requiring extended operational life.With 128 configurable GPIOs, designers can implement complex control matrices while maintaining spare capacity for future expansion, particularly valuable in modular industrial equipment.The 2MB (2M x 8) non-volatile storage accommodates sophisticated control algorithms with room for over-the-air updates, crucial for smart grid applications requiring field upgradability.FLASH technology ensures rapid boot times and exceptional data retention, outperforming traditional storage methods in harsh environmental conditions.A 512K x 8 volatile memory configuration supports multi-threaded operation with zero-wait-state access, enabling deterministic response times in motor control applications.The 0.95V ~ 3.6V operating range makes this device compatible with both legacy and modern power architectures, simplifying migration from older systems.The External clock source implementation reduces BOM costs while maintaining jitter performance below 1% of period, meeting stringent RF communication requirements.Rated for -40°C ~ 85°C (TA), this microcontroller maintains timing stability across extreme environmental conditions, making it suitable for downhole drilling instrumentation.Surface Mount packaging enables high-density PCB layouts while withstanding mechanical stress, ideal for vibration-prone automotive underhood applications.The 236-LFBGA format provides optimal thermal dissipation for continuous operation at maximum clock speeds, addressing thermal challenges in sealed industrial enclosures.Available in 236-FBGA (10x10), the device supports both prototype development and volume production with identical performance characteristics.
Product Attributes
- Product Status: Obsolete
- Core Processor: XCore
- Core Size: 32-Bit 10-Core
- Speed: 2000MIPS
- Connectivity: -
- Peripherals: -
- Number of I/O: 128
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 236-LFBGA
- Supplier Device Package: 236-FBGA (10x10)
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