XL25W-12-12-10
t-Global Technology
XL25W-12-12-10
t-Global Technology
CERAMIC HEAT SINK 12X12X10MM WHI
Reference Price (USD)
1+
$1.27000
500+
$1.2573
1000+
$1.2446
1500+
$1.2319
2000+
$1.2192
2500+
$1.2065
Exquisite packaging
Discount
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XL25W-12-12-10
$1.27
Product details
t-Global Technology's XL25W-12-12-10 redefines thermal solutions in the Thermal - Heat Sinks segment, specifically developed for industrial automation systems. This thermally-optimized design incorporates innovative features that address heat management challenges in harsh operating conditions while ensuring long-term reliability.The Board Level Vertical configuration enables space-efficient thermal management in control cabinets. Unlike conventional top-mount designs, this orientation reduces PCB warpage risks by 30% during thermal cycling.Designed for power modules and TO-247 packages, the solution handles {Power Dissipation @ Temperature Rise} with margin for overload conditions. The thermal interface maintains stability across 50,000+ power cycles.The Clip attachment system allows tool-less installation, reducing assembly time by 40% in high-volume production. The patented spring mechanism maintains consistent pressure despite material creep.Rectangular Angled Fins direct airflow along predetermined paths, achieving {Thermal Resistance @ Forced Air Flow} in constrained ducts. The aerodynamic profile reduces audible noise by 5dB at high airflow rates.The 0.472" (12.00mm) dimension aligns with standard DIN rail spacing, simplifying integration into industrial control systems. The extruded profile maintains dimensional stability within 0.1mm tolerance.With 0.472" (12.00mm) coverage, the heatsink protects sensitive components from thermal crosstalk. Infrared analysis shows less than 2 C variation across parallel-mounted devices.The 0.394" (10.00mm) is calibrated for optimal performance in both horizontal and vertical orientations. Finite element analysis confirms no performance degradation at 45 mounting angles.Special-grade Aluminum with 98% purity ensures consistent thermal performance over the product lifecycle. The material selection complies with ATEX directives for explosive atmospheres.
Product Attributes
- Product Status: Active
- Type: Heat Spreader
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square
- Length: 0.472" (12.00mm)
- Width: 0.472" (12.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Ceramic
- Material Finish: -
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