XL25B-10-10-3
t-Global Technology
XL25B-10-10-3
t-Global Technology
XL25 CERAMIC W/BUMPS 10X10X2MM
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XL25B-10-10-3
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Product details
t-Global Technology's XL25B-10-10-3 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 0.394" (10.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 0.394" (10.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.118" (3.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Obsolete
- Type: Heat Spreader
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: -
- Shape: Square
- Length: 0.394" (10.00mm)
- Width: 0.394" (10.00mm)
- Diameter: -
- Fin Height: 0.118" (3.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Ceramic
- Material Finish: -
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