XL25-40-40-3.0
t-Global Technology
XL25-40-40-3.0
t-Global Technology
XL25 CERAMIC BOARD 40X40X3MM
Reference Price (USD)
1+
$1.21000
500+
$1.1979
1000+
$1.1858
1500+
$1.1737
2000+
$1.1616
2500+
$1.1495
Exquisite packaging
Discount
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XL25-40-40-3.0
$1.21
Product details
The XL25-40-40-3.0 from t-Global Technology represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 1.575" (40.00mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 1.575" (40.00mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 0.118" (3.00mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Obsolete
- Type: Heat Spreader
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: -
- Shape: Square
- Length: 1.575" (40.00mm)
- Width: 1.575" (40.00mm)
- Diameter: -
- Fin Height: 0.118" (3.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Ceramic
- Material Finish: -
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