XL25-40-40-10

t-Global Technology

General info

Part Number

XL25-40-40-10

Manufacturer

t-Global Technology

Description:

CERAMIC HEAT SPREADER 40X40MM GR

Reference Price (USD)

$0.85000

500+

$0.8415

1000+

$0.833

1500+

$0.8245

2000+

$0.816

2500+

$0.8075

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

XL25-40-40-10

$0.85

Product details

The XL25-40-40-10 from t-Global Technology sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 1.575" (40.00mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 1.575" (40.00mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.394" (10.00mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.