XL212-512-FB236-I20
XMOS
XL212-512-FB236-I20
XMOS
IC MCU 32BIT ROMLESS 236FBGA
Reference Price (USD)
1+
$16.64554
500+
$16.4790846
1000+
$16.3126292
1500+
$16.1461738
2000+
$15.9797184
2500+
$15.813263
Exquisite packaging
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XL212-512-FB236-I20
$16.65
Product details
Designed for industrial IoT applications, the XL212-512-FB236-I20 by XMOS redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The XCore core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit 12-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 2000MIPS with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.With 128 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.The ROMless implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.512K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 0.95V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.The External design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 85°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 236-LFBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 236-FBGA (10x10), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 12-Core
- Speed: 2000MIPS
- Connectivity: -
- Peripherals: -
- Number of I/O: 128
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 236-LFBGA
- Supplier Device Package: 236-FBGA (10x10)
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