XCZU7EV-1FBVB900I
AMD Xilinx
XCZU7EV-1FBVB900I
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
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$3334.53000
500+
$3301.1847
1000+
$3267.8394
1500+
$3234.4941
2000+
$3201.1488
2500+
$3167.8035
Exquisite packaging
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XCZU7EV-1FBVB900I
$3,334.53
Product details
AMD Xilinx's XCZU7EV-1FBVB900I sets a new benchmark in Embedded - System On Chip (SoC) for high-speed data acquisition systems. Optimized for test and measurement equipment, this SoC delivers unparalleled analog-to-digital conversion performance while maintaining exceptional signal integrity for precision instrumentation applications.The MCU, FPGA architecture incorporates parallel processing pipelines that achieve real-time data analysis with minimal latency for oscilloscopes and spectrum analyzers.Powered by the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, the device handles complex waveform processing while maintaining precise timing synchronization across multiple channels.With 256KB of high-bandwidth RAM, the processor enables deep capture buffers for transient signal analysis.The DMA, WDT include multi-gigasample ADCs and programmable gain amplifiers that enhance measurement accuracy.High-speed CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces ensure seamless data transfer to host systems for real-time visualization and processing.Operating at 500MHz, 600MHz, 1.2GHz, the processor meets the stringent timing requirements of high-resolution data acquisition systems.Zynq®UltraScale+™ FPGA, 504K+ Logic Cells provide hardware-based triggering and windowing functions that accelerate measurement workflows.Designed for -40°C ~ 100°C (TJ) operation, the component maintains calibration accuracy across environmental variations.The 900-BBGA, FCBGA package offers excellent signal isolation and thermal stability for precision measurement applications.Available in 900-FCBGA (31x31), the device meets the reliability requirements of professional test equipment.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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