XCZU6EG-3FFVB1156E
AMD Xilinx
XCZU6EG-3FFVB1156E
AMD Xilinx
IC SOC CORTEX-A53 1156FCBGA
Reference Price (USD)
1+
$5153.70000
500+
$5102.163
1000+
$5050.626
1500+
$4999.089
2000+
$4947.552
2500+
$4896.015
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCZU6EG-3FFVB1156E
$5,153.70
Product details
The XCZU6EG-3FFVB1156E from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCZU6EG-3FFVB1156E particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 600MHz, 1.5GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Zynq®UltraScale+™ FPGA, 469K+ Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 1156-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 1156-FCBGA (35x35), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
You May Also Be Interested In
