XCZU5CG-1FBVB900I
AMD Xilinx
XCZU5CG-1FBVB900I
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
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$2383.74000
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$2359.9026
1000+
$2336.0652
1500+
$2312.2278
2000+
$2288.3904
2500+
$2264.553
Exquisite packaging
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XCZU5CG-1FBVB900I
$2,383.74
Product details
AMD Xilinx's XCZU5CG-1FBVB900I revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making XCZU5CG-1FBVB900I the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MCU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.With 256KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, WDT include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 500MHz, 1.2GHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.Zynq®UltraScale+™ FPGA, 256K+ Logic Cells include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for -40°C ~ 100°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 900-BBGA, FCBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 900-FCBGA (31x31), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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