XCZU4EV-L1FBVB900I
AMD Xilinx
XCZU4EV-L1FBVB900I
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
1+
$2135.28000
500+
$2113.9272
1000+
$2092.5744
1500+
$2071.2216
2000+
$2049.8688
2500+
$2028.516
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCZU4EV-L1FBVB900I
$2,135.28
Product details
AMD Xilinx's XCZU4EV-L1FBVB900I redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making XCZU4EV-L1FBVB900I the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 500MHz, 600MHz, 1.2GHz, the processor meets the real-time requirements of high-channel-count audio systems.Zynq®UltraScale+™ FPGA, 192K+ Logic Cells include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 900-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 900-FCBGA (31x31), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
You May Also Be Interested In
