XCZU4CG-2FBVB900I
AMD Xilinx
XCZU4CG-2FBVB900I
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
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$1927.41000
500+
$1908.1359
1000+
$1888.8618
1500+
$1869.5877
2000+
$1850.3136
2500+
$1831.0395
Exquisite packaging
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XCZU4CG-2FBVB900I
$1,927.41
Product details
AMD Xilinx's XCZU4CG-2FBVB900I redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making XCZU4CG-2FBVB900I the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 533MHz, 1.3GHz, the processor meets the real-time requirements of high-channel-count audio systems.Zynq®UltraScale+™ FPGA, 192K+ Logic Cells include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 900-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 900-FCBGA (31x31), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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