XCZU2CG-L2UBVA530E
AMD Xilinx
XCZU2CG-L2UBVA530E
AMD Xilinx
IC ZUP MPSOC A53 FPGA LP 530BGA
Reference Price (USD)
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$372.69000
500+
$368.9631
1000+
$365.2362
1500+
$361.5093
2000+
$357.7824
2500+
$354.0555
Exquisite packaging
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XCZU2CG-L2UBVA530E
$372.69
Product details
AMD Xilinx's XCZU2CG-L2UBVA530E revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making XCZU2CG-L2UBVA530E the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MPU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.With 256KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, WDT include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 533MHz, 1.3GHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.Zynq®UltraScale+™ FPGA, 103K+ Logic Cells include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for 0°C ~ 100°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 530-WFBGA, FCBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 530-FCBGA (16x9.5), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 530-WFBGA, FCBGA
- Supplier Device Package: 530-FCBGA (16x9.5)
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