XCZU1CG-1SFVC784E
AMD Xilinx
XCZU1CG-1SFVC784E
AMD Xilinx
IC ZUP MPSOC A53 FPGA 784BGA
Reference Price (USD)
1+
$232.47000
500+
$230.1453
1000+
$227.8206
1500+
$225.4959
2000+
$223.1712
2500+
$220.8465
Exquisite packaging
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XCZU1CG-1SFVC784E
$232.47
Product details
The XCZU1CG-1SFVC784E from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCZU1CG-1SFVC784E particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MPU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.Operating at 500MHz, 1.2GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 784-BFBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 784-FCBGA (23x23), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: -
- Speed: 500MHz, 1.2GHz
- Primary Attributes: -
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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