XCZU19EG-L1FFVC1760I
AMD Xilinx
XCZU19EG-L1FFVC1760I
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
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$8218.86000
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$8136.6714
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$8054.4828
1500+
$7972.2942
2000+
$7890.1056
2500+
$7807.917
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XCZU19EG-L1FFVC1760I
$8,218.86
Product details
The XCZU19EG-L1FFVC1760I from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCZU19EG-L1FFVC1760I particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 500MHz, 600MHz, 1.2GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for -40°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 1760-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 1760-FCBGA (42.5x42.5), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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