XCZU19EG-1FFVC1760E
AMD Xilinx
XCZU19EG-1FFVC1760E
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
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$5870.79000
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$5812.0821
1000+
$5753.3742
1500+
$5694.6663
2000+
$5635.9584
2500+
$5577.2505
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XCZU19EG-1FFVC1760E
$5,870.79
Product details
AMD Xilinx's XCZU19EG-1FFVC1760E redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making XCZU19EG-1FFVC1760E the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 500MHz, 600MHz, 1.2GHz, the processor meets the real-time requirements of high-channel-count audio systems.Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for 0°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 1760-BBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 1760-FCBGA (42.5x42.5), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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