XCZU17EG-3FFVD1760E
AMD Xilinx
XCZU17EG-3FFVD1760E
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
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XCZU17EG-3FFVD1760E
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Product details
Engineered for next-generation automotive electronics, AMD Xilinx's XCZU17EG-3FFVD1760E redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making XCZU17EG-3FFVD1760E the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 600MHz, 667MHz, 1.5GHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Zynq®UltraScale+™ FPGA, 926K+ Logic Cells include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 1760-BBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 1760-FCBGA (42.5x42.5), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 667MHz, 1.5GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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