XCZU17EG-2FFVE1924I
AMD Xilinx
XCZU17EG-2FFVE1924I
AMD Xilinx
IC SOC CORTEX-A53 1924FCBGA
Reference Price (USD)
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$8527.59000
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$8442.3141
1000+
$8357.0382
1500+
$8271.7623
2000+
$8186.4864
2500+
$8101.2105
Exquisite packaging
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XCZU17EG-2FFVE1924I
$8,527.59
Product details
The XCZU17EG-2FFVE1924I by AMD Xilinx is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 533MHz, 600MHz, 1.3GHz, the processor balances performance with power efficiency for always-on sensing applications.Zynq®UltraScale+™ FPGA, 926K+ Logic Cells feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 1924-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 1924-FCBGA (45x45), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 600MHz, 1.3GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1924-BBGA, FCBGA
- Supplier Device Package: 1924-FCBGA (45x45)
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