XCZU15EG-3FFVC900E
AMD Xilinx
XCZU15EG-3FFVC900E
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
1+
$7568.19000
500+
$7492.5081
1000+
$7416.8262
1500+
$7341.1443
2000+
$7265.4624
2500+
$7189.7805
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCZU15EG-3FFVC900E
$7,568.19
Product details
AMD Xilinx's XCZU15EG-3FFVC900E revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making XCZU15EG-3FFVC900E the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MCU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.With 256KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, WDT include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 600MHz, 667MHz, 1.5GHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.Zynq®UltraScale+™ FPGA, 747K+ Logic Cells include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for 0°C ~ 100°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 900-BBGA, FCBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 900-FCBGA (31x31), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 667MHz, 1.5GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
You May Also Be Interested In
