XCVC1802-2LSEVSVA2197
AMD Xilinx
XCVC1802-2LSEVSVA2197
AMD Xilinx
IC VERSAL AICORE FPGA 2197BGA
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XCVC1802-2LSEVSVA2197
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Product details
The XCVC1802-2LSEVSVA2197 from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCVC1802-2LSEVSVA2197 particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MPU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DDR, DMA, PCIe include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 450MHz, 1.08GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Versal™ AI Core FPGA, 1.5M Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 2197-BFBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 2197-FCBGA (45x45), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 450MHz, 1.08GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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