XCVC1802-1LSIVSVD1760
AMD Xilinx
XCVC1802-1LSIVSVD1760
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
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XCVC1802-1LSIVSVD1760
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Product details
AMD Xilinx's XCVC1802-1LSIVSVD1760 revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making XCVC1802-1LSIVSVD1760 the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MPU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.With 256KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DDR, DMA, PCIe include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 400MHz, 1GHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.Versal™ AI Core FPGA, 1.5M Logic Cells include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for -40°C ~ 100°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 1760-BFBGA, FCBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 1760-FCBGA (40x40), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BFBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (40x40)
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