XCKU040-3SFVA784E
AMD Xilinx
XCKU040-3SFVA784E
AMD Xilinx
IC FPGA 468 I/O 784FCBGA
Reference Price (USD)
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$2921.25000
500+
$2892.0375
1000+
$2862.825
1500+
$2833.6125
2000+
$2804.4
2500+
$2775.1875
Exquisite packaging
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Product details
AMD Xilinx's XCKU040-3SFVA784E pioneers advanced video processing in Embedded - FPGAs (Field Programmable Gate Array), specifically engineered for 8K resolution and HDR applications. This FPGA delivers unprecedented pixel processing capabilities combined with ultra-low latency, making it ideal for professional broadcast equipment and medical imaging systems. The architecture includes specialized color processing blocks and real-time compression engines.Organized into 30300 video-optimized logic blocks, the architecture supports pipelined pixel processing. Each block includes dedicated line buffers for efficient frame processing.The 530250 high-performance logic elements enable real-time processing of multiple 8K video streams. When configured for video pipeline applications, the architecture demonstrates superior throughput compared to conventional DSP solutions.With 21606000 bits of ultra-wide memory, the device buffers complete video frames with multiple color planes. The memory subsystem implements smart prefetch algorithms to optimize bandwidth utilization.The 468 high-speed serial interfaces support HDMI 2.1 and DisplayPort 2.0 standards. Each I/O bank includes adaptive equalization to compensate for cable losses in long-distance video transmission.Operating within 0.970V ~ 1.030V range, the power delivery network maintains clean supplies for sensitive analog video processing. The distributed voltage regulation minimizes ground bounce during high-speed pixel transfers.The Surface Mount mounting solution ensures reliable operation in rack-mounted video equipment. The package design incorporates EMI shielding for clean signal transmission.Qualified for 0°C ~ 100°C (TJ) operation, the device maintains consistent video quality across broadcast environment conditions. The thermal throttling mechanism prevents artifacts during extended operation.The 784-BFBGA, FCCSP package implements advanced heat spreading techniques for high-power video processing. The low-thermal-resistance design enables passive cooling in many applications.Available in 784-FCCSPBGA (23x23) format, the device meets broadcast equipment reliability standards. The packaging includes handling protection for sensitive BGA connections.
Product Attributes
- Product Status: Active
- Number of LABs/CLBs: 30300
- Number of Logic Elements/Cells: 530250
- Total RAM Bits: 21606000
- Number of I/O: 468
- Number of Gates: -
- Voltage - Supply: 0.970V ~ 1.030V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BFBGA, FCCSP
- Supplier Device Package: 784-FCCSPBGA (23x23)