XC7Z045-1FBG676CES
AMD Xilinx
XC7Z045-1FBG676CES
AMD Xilinx
IC SOC CORTEX-A9 667MHZ 676FCBGA
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XC7Z045-1FBG676CES
$0.00
Product details
AMD Xilinx's XC7Z045-1FBG676CES sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where XC7Z045-1FBG676CES excels in noise immunity and long-term stability.The innovative MCU, FPGA architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.With 256KB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DMA enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.Advanced CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options facilitate seamless integration with industrial fieldbus networks and legacy control systems alike.The 667MHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.Kintex™-7 FPGA, 350K Logic Cells deliver hardware-based safety features including watchdog timers and memory protection units required for SIL-3 certified equipment.Designed for 0°C ~ 85°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 676-BBGA, FCBGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 676-FCBGA (27x27) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Obsolete
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
You May Also Be Interested In
